Hybrid-IC

Introduction

A Korean company is offering this technology of hybrid-ic. The features of this technology are:- software for testing hybrid ic printing on thick-film (200µm) high-temperature plasticity profile managing technology trimming technology high-velocity, high-density mount technology COB-technology (Al wire bonding 150µm) manufacturing management technology

Area of Application: Electronics industry

Advantages: Transfer manufacturing know-how with documents and services Assist factory automation and design automation facilities

Development Status Commercialised

For further information please contact :

Asian and Pacific Centre for Transfer of Technology
APCTT Building
C-2 Qutab Institutional Area
P.O.Box - 4575
New Delhi - 110 016
Tel : 91-11-26966509
Fax : 91-11-26856274