Electronics &
Communication Technologies -
Chemically Enhanced Polishing (CEP) Technology for
Semiconductor Manufacturing
Introduction
Korean leading electronics company offers advanced chemically
enhanced polishing (CEP) technology for manufacturing
of semiconductors. The CEP process replaces the conventional
CMP technology that has a number of shortcomings, including
low polishing rate; poor uniformity and reproducibility;
air exposure of slurry supply system; polishing with
back-surface reference; and difficulty with in-situ
monitoring. This new technology demonstrated better
results compared with conventional CMP process in tests
with Tungsten plug. The removal rate uniformity of CEP
process is well controlled by rotation speed and location
of injection nozzle. No damage on alignment key, that
is a frequent problem with CMP, is observed in the CEP
process.
Area of Application: Planarization
process of semiconductor manufacturing.
Advantages: Economic,
high productivity planarization technology Good process
controllability High throughput process yields Improved
local and global planarization No post-CEP cleaning
required No consumables other than chemicals Low cost
of equipment Co
Development Status Commercialised
For further information
please contact :
Asian and Pacific Centre for Transfer
of Technology
APCTT Building
C-2 Qutab Institutional Area
P.O.Box - 4575
New Delhi - 110 016
Tel : 91-11-26966509
Fax : 91-11-26856274
